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![PDF] Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/0279ce3de94fdcf14e316f04117761882de7817d/1-Figure1-1.png "PDF] Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly | Semantic Scholar")
PDF] Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly | Semantic Scholar
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Title of Presentation
Understanding the Welding Failure in BGA Head-in-Pillow | IMI
Testing and prevention of head-in-pillow (98672 R0)
COLLABORATION BETWEEN OEM AND EMS TO COMBAT HEAD ON PILLOWING DEFECTS: PART 1 – AXI CAPABILITY FOR HOP DETECTION
